STM and JESDAF respectively. A typical Human Body Model circuit is presented in Figure 1. Figure 1: Typical Human Body Model Circuit. In September , a small group of ESD control and design stakeholders assembled in a Read More». In the EERC Resource Center. A Dash of Maxwell’s. JESDAF. – IEC (C= pF). – MIL method Pulse parameters. HBM. Reference voltage. 2KV 4KV. Peak current. A A.

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It is not permissible to use a test chip representative of the actual chip or to assign threshold voltages based kesd22 data compiled from a design library or via software simulations.

Connect this pin to Terminal B where it will remain the referenced pin throughout the worst-case pin search and connect one of the remaining pins to Terminal A. Some advanced technologies may be vulnerable to these pulses resulting in an electrical overstress EOS.

It is permitted to use a separate sample of 3 devices for each pin combination set specified in Table 2. I recommend changes to the following: The period between waveform checks may be extended providing test data supports the increased interval. Active discrete devices FETs, transistors, etc. The number of power pins tested on Terminal A may be reduced if the power pin group is connected on a package plane see clause 4. The pin connected to terminal A is to be stressed to each of these subsets separately.

The ends of the wire may be ground to a point where clearance is needed to make contact on fine-pitch socket pins. Example of proposed changes being utilized Test Flow 1 HBM testing will be done in adherence to Table hesd22, with selected pin combinations replaced by alternative pin combinations. JEDEC standards and a114v are adopted without regard to whether or not their adoption may involve patents or articles, materials, x114f processes.

Added in 4 language stating clearly that ESD testing must be performed on samples of the actual chip being evaluated In 4. The pin combination with the waveform closest to the limits see Table 1 shall be designated for waveform verification. Apply a positive and negative V pulse and verify that the waveform meets the requirements defined in Table 1. Documents Flashcards Grammar checker. Reduced minimum interval between zaps to milliseconds. The measured voltage and the time that it is present on the device can then be compared to the known reliability mechanisms of the technology, such as time dependent dielectric breakdown TDDBto determine if a reliability concern is posed by the HBM tester.


JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and a114d of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.

The test devices shall be within the limits stated in the part drawing for these parameters. In the test sequences where this power pin jesd222 is held at ground Terminal Bit is permitted to have all the pins in the group tied together and connected to Terminal B or to have only the previously selected pin s connected to Terminal B with all other pins in the group left floating.

Connect this pin to Terminal B and then connect the socket pin with the longest wiring path from the pulse generating circuit to the test socket to Terminal A normally provided by the manufacturer. NOTE 3 R2, used for initial equipment qualification and requalification as specified in 3.

Attach a shorting wire between these pins with the current probe around the shorting wire. However, if another higher starting voltage level is used and the device fails, testing shall be restarted with a fresh device at the next jwsd22 level. It is permitted to use the same sample 3 at the next jesd2 voltage stress level if all parts pass the failure criteria specified in clause 5 after ESD exposure to a specified voltage level.

Clarified power pin definitions. It is not permissible to use a test chip representative of the actual chip or to assign threshold voltages based on data compiled from a design library or via software simulations.

Other pins in the group do not need to be stressed. Other suggestions for document improvement: I recommend changes to the following: Verify that all parameters meet the limits specified in Table 1 and Figure 2. By downloading this file the individual agrees not to charge for or resell the resulting material.

In case the waveform no a11f meets the limits in Table 1, all ESD testing performed after the previous satisfactory waveform jrsd22 will be considered invalid.

ESD Tests | Reliability Technology Division | Services | OKI Engineering

This tester issue was found to divert significant current away from the pins connected to Terminal B, such that the slew-rate of the current at terminal B is lower than seen at Terminal A.


Included pins connected to charge pump capacitors as power pins. The V level is optional. Any pin that is intended to supply power to another circuit on the same chip must be treated as a power pin.


This may require additional testing as each nonsupply pin must be treated as an individual power pin group. The pin connected to terminal A is to be stressed to each of these subsets separately. While most power pins are labeled such that they can be easily recognized as power pins examples: As an alternative to this method, it is permitted to partition the pins to be connected to terminal B into two or more subsets, such that each of these pins is a member of at least one subset.

It is recommended that the manufacturers supply the worst-case pin data with each DUT board. Guard band testing is also permitted. The probe transformer and cable with a nominal length of 1 meter shall have a 1 GHz bandwidth, a minimum current rating of 12 amperes peak pulse-current capability and a rise time of less than one nanosecond.

If you can provide input, please complete this form and return to: Power pins that are directly connected by metal inside the package form a power pin group. The high-voltage relays and associated high-voltage circuitry shall be tested by the user of computercontrolled systems per the equipment manufacturer’s instructions system diagnostics.


Any part that fails after exposure to an ESD pulse of V or less. The reference pin combination shall be identified by determining the socket pin with the shortest wiring path from the pulse generating circuit to the test socket.

The simulator must jeesd22 capable of supplying pulses with the characteristics required by Figure 2 and Figure 3. All pins one at time to Gnd2 power pin group 3.